C++ Design and Implementation Challenges in
Technology Computer Aided Design Frameworks
Goodwin R. Chin (gchin@watson.ibm.com)[y], Dharini
Sitaraman[z], Chung Yang[z], and Martin D. Giles
(madagil@dip.eecs.umich.edu)[z]
[y] IBM T. J. Watson Research Center, Yorktown Heights, NY 10598.
[z] Solid State Electronics Laboratory, University of Michigan,
Ann Arbor, MI 48109.
Abstract
Interoperability of physical simulation tools is often cumbersome due
to dif- ferences in domain representation. The Technology Computer
Aided Design (TCAD) community (1) has realized this problem and is
working on providing an object-oriented interface for representing and
manipulating the state of a semiconductor wafer during process and
device simulation, the Semiconduc- tor Wafer Representation (SWR) [1,
2, 3]. We describe an implementation of components of a 3D SWR
designed to support the needs of many TCAD simulators. A set of
classes provide support for solid modeling operations, mesh refinement
operations, and data interchange. A layered memory subsystem allows
either uniprocess or client/server operation. Run-time type
identification provides dynamic extensibility of data types.
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